公开(公告)号：US20250138585A1

公开(公告)日：2025-05-01

申请号：US19004944

申请日：2024-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonghun GU ,  Keunpyo PARK ,  Youngho PARK ,  Jiwoo LEE ,  Kio JUNG ,  Ko CHOI ,  Woojin CHOI

IPC: G06F1/16 ,  H05K7/14

Abstract: An example electronic device may include a first housing on which a first printed circuit board including a processor is disposed, a second housing on which a second printed circuit board including a display driver for a display is disposed, a hinge structure configured to physically connect the first housing and the second housing such that the first housing and the second housing are foldable/unfoldable, and a cable structure configured to electrically connect the first printed circuit board and the second printed circuit board via the hinge structure. The cable structure may include a first cable configured to transfer display signals and a second cable branched off from the first cable to be grounded to the hinge structure.

公开(公告)号：US20230100675A1

公开(公告)日：2023-03-30

申请号：US17989316

申请日：2022-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonghun GU ,  Keunpyo PARK ,  Youngho PARK ,  Jiwoo LEE ,  Kio JUNG ,  Ko CHOI ,  Woojin CHOI

IPC: G06F1/16 ,  H05K7/14

Abstract: An electronic device according to various embodiments of the disclosure may include a first housing on which a first printed circuit board including a processor is disposed, a second housing on which a second printed circuit board including a display driver for a display is disposed, a hinge structure configured to physically connect the first housing and the second housing such that the first housing and the second housing are foldable/unfoldable, and a cable structure configured to electrically connect the first printed circuit board and the second printed circuit board via the hinge structure. The cable structure may include a first cable configured to transfer display signals and a second cable branched off from the first cable to be grounded to the hinge structure.