公开(公告)号：US20240161229A1

公开(公告)日：2024-05-16

申请号：US18446927

申请日：2023-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiman KIM

IPC: G06T3/40 ,  G06T7/13 ,  H04N7/01

CPC classification number: G06T3/40 ,  G06T7/13 ,  H04N7/0127 ,  G06T2207/10016 ,  G06T2207/20021 ,  G06T2207/20132 ,  G06T2207/20221

Abstract: An image processing device includes a memory configured to store instruction thereon; and a processing circuitry configured to execute the instructions. The processing circuitry is configured to execute the instructions to cause the image processing device to divide input video data into a plurality of input video sub-data corresponding to a plurality of sub-areas, generate a plurality of output video sub-data by performing image processing operations on the plurality of input video sub-data, respectively, generate output video data corresponding to the input video data by merging the plurality of output video sub-data. Each of the plurality of input video sub-data includes main input sub-data corresponding to a respective sub-area among the plurality of sub-areas, and boundary input sub-data corresponding to a portion of an adjacent sub-area adjacent to the respective sub-area among the plurality of sub-areas.

公开(公告)号：US20240073307A1

公开(公告)日：2024-02-29

申请号：US18387351

申请日：2023-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bumhee BAE ,  Kiman KIM ,  Junggil KIM ,  Younghun SEONG ,  Jeongnam CHEON

IPC: H04M1/02 ,  H05K1/02 ,  H05K1/18

CPC classification number: H04M1/0277 ,  H04M1/0216 ,  H04M1/0274 ,  H05K1/0253 ,  H05K1/189

Abstract: A flexible circuit board and a foldable electronic device includes a first multi-layer region, a second multi-layer region and a highly bendable region disposed between the first multi-layer region and the second multi-layer region. The first multi-layer region and the second multi-layer region include a structure in which a plurality of copper clad laminates (CCLs) are stacked. The highly bendable region includes a structure in which a single CCL extending from one CCL among the plurality of CCLs in the first multi-layer region and the second multi-layer region is stacked. The single CCL may be configured such that a first ground wire, a second ground wire, and a plurality of sub wires disposed to be spaced apart between the first ground wire and the second ground wire transmit a single RF signal.

公开(公告)号：US20220173498A1

公开(公告)日：2022-06-02

申请号：US17436479

申请日：2019-12-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonjae LEE ,  Minsoo KIM ,  Hyuntae JUNG ,  Kiman KIM ,  Jiwoo LEE

IPC: H01Q1/24 ,  H01Q1/38 ,  H04M1/02

Abstract: According to various embodiments, an electronic apparatus comprises: a housing including a front plate, a rear plate disposed facing a direction opposite the front plate, and a side bezel enclosing at least a portion of the space between the front plate and the rear plate; a circuit board disposed between the front plate and the rear plate; a first radiating conductor disposed to form at least a portion of the side bezel; a connection member comprising a conductive material disposed between the circuit board and the rear plate; and a processor or communication module comprising communication circuitry disposed on the circuit board. The connection member includes a first curved part provided on one end and contacting the circuit board, and a second curved part provided on another end and contacting the first radiating conductor, thereby electrically connecting the first radiating conductor to the circuit board. The processor or communication module can be configured to use the first radiating conductor to perform wireless communication in at least one frequency band.