公开(公告)号：US10109617B2

公开(公告)日：2018-10-23

申请号：US15652559

申请日：2017-07-18

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Kwang-Ryul Lee ,  Boseong Kim ,  Taeduk Nam ,  Wangju Lee

IPC分类号： H01L23/552 ,  H01L25/18 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00

摘要： A solid state drive package is provided. The solid state drive package may include an integrated circuit substrate including: a lower redistribution layer; a first chip and a second chip provided on the lower redistribution layer; and a connection substrate provided on the lower redistribution layer, the connection substrate provided on an outer periphery of the first chip and the second chip; and a plurality of third chips provided on the integrated circuit substrate. The plurality of third chips are electrically connected to the first chip and the second chip via the connection substrate and the lower redistribution layer.