公开(公告)号：US12094904B2

公开(公告)日：2024-09-17

申请号：US17342254

申请日：2021-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungmok Son ,  Hyejung Kim

IPC: H01L27/146

CPC classification number: H01L27/1463 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14645 ,  H01L27/14689

Abstract: An image sensor includes: on a substrate that includes a first surface and a second surface opposite to the first surface, photoelectric conversion regions located in the substrate, the photoelectric conversion regions being separated from each other; partition layers spaced apart from the first surface and between the photoelectric conversion regions; and pixel separation layers on the partition layers that separate the photoelectric conversion regions from each other.