公开(公告)号：US11043446B2

公开(公告)日：2021-06-22

申请号：US16662360

申请日：2019-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungsoo Park ,  Kyoungmoo Harr ,  Jihyun Lee ,  Doohwan Lee ,  Junggon Choi

IPC: H01L29/06 ,  H01L21/44 ,  H01L23/495 ,  H01L23/367 ,  H01L23/48

Abstract: A semiconductor package includes a connection structure including a first insulating layer, a first redistribution layer disposed on the first insulating layer, and a first connection via penetrating through the first insulating layer and connected to the first redistribution layer, a semiconductor chip disposed on the connection structure, an encapsulant covering at least a portion of the semiconductor chip, a second insulating layer disposed on the encapsulant, a second redistribution layer including a signal line disposed on the encapsulant, and a heat dissipation layer disposed on the encapsulant and electrically insulated from the signal line.