公开(公告)号：US20250140726A1

公开(公告)日：2025-05-01

申请号：US18738153

申请日：2024-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyunglyul LEE ,  Jooyoung OH

IPC: H01L23/00

Abstract: A semiconductor package includes: a package substrate having a first region and a second region; first connection pads disposed on the first region of the package substrate, and having a first height; second connection pads disposed on the second region of the package substrate, and having a second height that is lower than the first height; a semiconductor chip including first chip pads, second chip pads, and a protective insulating layer, wherein the first chip pads are disposed in the first region, wherein the second chip pads are disposed in the second region, and wherein the protective insulating layer is disposed on the second chip pads; first bump structures disposed on the first chip pads, and respectively connected to the first connection pads; and second bump structures disposed on the protective insulating layer, wherein the second bump structures are respectively connected to the second connection pads.