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公开(公告)号：US20210375739A1
公开(公告)日：2021-12-02
申请号：US17401376
申请日：2021-08-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung Han KIM , Masazumi AMAGAI , Ju Ho KIM , Tae Sung JEONG
IPC: H01L23/498 , H01L23/00 , H01L23/538
Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.
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