公开(公告)号：US20220375983A1

公开(公告)日：2022-11-24

申请号：US17573826

申请日：2022-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Kuk Kang ,  Min Ho Jang ,  Hoon Joo Na ,  Hee Ju Shin

IPC: H01L27/146

Abstract: An image sensor is provided. The image sensor includes unit pixels inside the substrate; a pixel separation pattern provided between the unit pixels, inside the substrate; a first inter-wiring insulating film provided on the first surface of the substrate; a pad pattern provided inside the first inter-wiring insulating film; a first connection pattern provided inside the first inter-wiring insulating film, an upper surface of the first connection pattern and an upper surface of the first inter-wiring insulating film being provided along a first common plane; a second inter-wiring insulating film provided on the upper surface of the first inter-wiring insulating film; a second connection pattern provided inside the second inter-wiring insulating film, a lower surface of the second connection pattern and a lower surface of the second inter-wiring insulating film being provided along a second common plane; and a microlens provided on the second surface of the substrate. The first connection pattern is provided in an island shape from a planar viewpoint.

公开(公告)号：US12230658B2

公开(公告)日：2025-02-18

申请号：US17548712

申请日：2021-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Ho Jang ,  Seung Kuk Kang ,  Hae Sung Jung ,  Kwan Sik Cho ,  Ho-Chul Ji

IPC: H01L27/146

Abstract: An image sensor includes a substrate having first and second surfaces and first and second regions. Unit pixels including photoelectric conversion layers are arranged inside the first region. A pixel separation pattern extends from the first surface to the second surface in the first region, separates each of the unit pixels, and includes a pixel separation spacer film and a pixel separation filling film. A dummy pixel separation pattern extends from the first surface to the second surface in the second region, and includes a dummy pixel separation filling film. A wiring structure disposed on the second surface includes an inter-wiring insulating film and a first wiring. A first contact directly connects the dummy pixel separation filling film and connects the dummy pixel separation filling film to the first wiring. A height of the pixel separation filling film is greater than a height of the dummy pixel separation filling film.