公开(公告)号：US20180180930A1

公开(公告)日：2018-06-28

申请号：US15853132

申请日：2017-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Jae CHO ,  Myeong Gil KIM ,  Seo Joon LEE ,  Hyun Jun JUNG ,  Jong Hee HAN

IPC: G02F1/1333 ,  G02F1/1345 ,  G02F1/1335

CPC classification number: G02F1/133308 ,  G02F1/1333 ,  G02F1/133528 ,  G02F1/13452 ,  G02F2001/133302 ,  G02F2001/133314 ,  G02F2001/133325 ,  G02F2001/133331 ,  G02F2202/28

Abstract: A panel module including a display panel, a chips-on-film (COF) having a first end connected to an end portion of the display panel, and a COF cover configured to extend past the first end of the COF to block the first end of the COF, the cover having a front surface formed to be coplanar with a front surface of the display panel.