-
公开(公告)号：US10649256B2
公开(公告)日：2020-05-12
申请号：US15853132
申请日：2017-12-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Min Jae Cho , Myeong Gil Kim , Seo Joon Lee , Hyun Jun Jung , Jong Hee Han
IPC: G02F1/1333 , G02F1/1345 , G02F1/1335
Abstract: A panel module including a display panel, a chips-on-film (COF) having a first end connected to an end portion of the display panel, and a COF cover configured to extend past the first end of the COF to block the first end of the COF, the cover having a front surface formed to be coplanar with a front surface of the display panel.
Search Results
1
records
(took 0.011 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
