公开(公告)号：US20220108935A1

公开(公告)日：2022-04-07

申请号：US17354291

申请日：2021-06-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunseok CHO ,  Minjeong GU ,  Joonsung KIM ,  Jaehoon CHOI

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/18 ,  H01L25/065

Abstract: A semiconductor package includes a base substrate including a wiring pattern, an interposer substrate including lower and upper redistribution patterns, a semiconductor structure, a heat dissipation structure, a plurality of external connection bumps disposed on a lower surface of the base substrate, a plurality of lower connection bumps disposed between the base substrate and the interposer substrate, and a plurality of upper connection bumps disposed between the interposer substrate and the semiconductor structure.

公开(公告)号：US20250069979A1

公开(公告)日：2025-02-27

申请号：US18943337

申请日：2024-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunseok CHO ,  Minjeong GU ,  Joonsung KIM ,  Jaehoon CHOI

IPC: H01L23/367 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/065 ,  H01L25/18

Abstract: A method of manufacturing a semiconductor package is provided and includes: forming a lower redistribution structure, the lower redistribution structure including lower redistribution patterns having lower connection pads; forming an upper redistribution structure on a boundary surface of the lower redistribution structure, the upper redistribution structure including upper redistribution patterns having upper connection pads electrically connected to the lower connection pads; forming openings exposing at least a portion of each of the lower connection pads; disposing an interposer substrate, including the lower redistribution structure and the upper redistribution structure, on a base substrate, the lower connection pads of the interposer substrate electrically connected to wiring patterns of the base substrate through lower connection bumps disposed on the openings; and disposing at least one of semiconductor chips, including connection pads, on the interposer substrate, the connection pads electrically connected to the upper connection pads through upper connection bumps.