公开(公告)号：US12112970B2

公开(公告)日：2024-10-08

申请号：US17460424

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daeho Min ,  Junhyung Kim ,  Minsoo Han ,  Mngu Lee ,  Minwoo Rhee

IPC: H01L21/683 ,  B25J15/06 ,  B65G47/91

CPC classification number: H01L21/6838 ,  B25J15/0683 ,  B65G47/91 ,  B65G2249/045

Abstract: A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.