公开(公告)号：US20200303314A1

公开(公告)日：2020-09-24

申请号：US16414016

申请日：2019-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Sam KANG ,  Yong Jin PARK ,  Young Gwan KO ,  Moon II KIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66

Abstract: A semiconductor package includes a semiconductor chip having connection pads on one surface thereof, a first encapsulant covering at least portions of the semiconductor chip, and a connection structure disposed on the one surface of the semiconductor chip and including one or more redistribution layers electrically connected to the connection pads. A wiring structure is disposed on one surface of the first encapsulant opposing another surface of the first encapsulant facing towards the connection structure. The wiring structure has a passive component embedded therein, and includes one or more wiring layers electrically connected to the passive component. The one or more redistribution layers and the one or more wiring layers are electrically connected to each other.