公开(公告)号：US20250132137A1

公开(公告)日：2025-04-24

申请号：US18816957

申请日：2024-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun Seok Kim ,  Mukyeong Kim ,  Sejin Park ,  Iljeong Heo

IPC: H01J37/32 ,  C25B1/04 ,  C25B15/08

Abstract: A scrubber includes a plasma treatment system, a hydrogen supply system, and a wet treatment system. The plasma treatment system performs a plasma treatment in which a process gas and a hydrogen gas are reacted using plasma. The hydrogen supply system supplies the hydrogen gas to the plasma treatment system. The wet treatment system performs a wet treatment in which a by-product generated by the plasma treatment is wet-treated.