公开(公告)号：US20240145388A1

公开(公告)日：2024-05-02

申请号：US18409447

申请日：2024-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Kyu HAN ,  Myeongsoo LEE ,  Rakhwan KIM ,  Woojin JANG

IPC: H01L23/528 ,  H01L23/522

CPC classification number: H01L23/5283 ,  H01L23/5226 ,  H01L27/092

Abstract: An integrated circuit device includes a substrate and a first electrically insulating layer on the substrate. An electrically conductive contact plug is provided, which extends at least partially through the first electrically insulating layer. The contact plug includes a protrusion having a top surface that is spaced farther from the substrate relative to a top surface of a portion of the first electrically insulating layer extending adjacent the contact plug. An electrically conductive line is provided with a terminal end, which extends on a first portion of the protrusion. A second electrically insulating layer is provided, which extends on a second portion of the protrusion and on the first electrically insulating layer. The second electrically insulating layer has a sidewall, which extends opposite a sidewall of the terminal end of the electrically conductive line.