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公开(公告)号:US09337112B2
公开(公告)日:2016-05-10
申请号:US14725603
申请日:2015-05-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ping Hsun Su , Yoonhae Kim , Hwasung Rhee
IPC: H01L21/8234 , H01L21/66
CPC classification number: H01L22/34
Abstract: A semiconductor device is provided. First and second pads are electrically connected to a plurality of test structures. Each test structure includes an active region, active patterns, gate electrodes and an electrode pattern. The active region includes a rounded corner portion. The active patterns protrudes from the semiconductor substrate and extends in parallel in a first direction. The gate electrodes crosses over the active patterns in a second direction. One gate electrode is electrically connected to the first pad. The electrode pattern is disposed at a side of the gate electrode electrically connected to the first pad. The electrode pattern is electrically connected to the second pad. The electrode pattern crosses over the active patterns. An overlapping area of the electrode pattern and the active patterns in each test structure is different from an overlapping area of the electrode pattern and the active patterns in other test structures.
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公开(公告)号:US20160020159A1
公开(公告)日:2016-01-21
申请号:US14725603
申请日:2015-05-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ping Hsun Su , Yoonhae Kim , Hwasung Rhee
IPC: H01L21/66
CPC classification number: H01L22/34
Abstract: A semiconductor device is provided. First and second pads are electrically connected to a plurality of test structures. Each test structure includes an active region, active patterns, gate electrodes and an electrode pattern. The active region includes a rounded corner portion. The active patterns protrudes from the semiconductor substrate and extends in parallel in a first direction. The gate electrodes crosses over the active patterns in a second direction. One gate electrode is electrically connected to the first pad. The electrode pattern is disposed at a side of the gate electrode electrically connected to the first pad. The electrode pattern is electrically connected to the second pad. The electrode pattern crosses over the active patterns. An overlapping area of the electrode pattern and the active patterns in each test structure is different from an overlapping area of the electrode pattern and the active patterns in other test structures.
Abstract translation: 提供半导体器件。 第一和第二焊盘电连接到多个测试结构。 每个测试结构包括有源区,有源图案,栅电极和电极图案。 活动区域包括圆角部分。 有源图案从半导体衬底突出并沿第一方向平行延伸。 栅电极在第二方向上跨过有源图案。 一个栅电极电连接到第一焊盘。 电极图案设置在与第一焊盘电连接的栅电极的一侧。 电极图案电连接到第二垫。 电极图案穿过有源图案。 每个测试结构中的电极图案和活性图案的重叠区域与其他测试结构中的电极图案和活动图案的重叠区域不同。
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公开(公告)号:US09082739B2
公开(公告)日:2015-07-14
申请号:US14261513
申请日:2014-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ping Hsun Su , Yoonhae Kim , Hwasung Rhee
IPC: H01L21/8234 , H01L21/66
CPC classification number: H01L22/34
Abstract: A semiconductor device is provided. First and second pads are electrically connected to a plurality of test structures. Each test structure includes an active region, active patterns, gate electrodes and an electrode pattern. The active region includes a rounded corner portion. The active patterns protrudes from the semiconductor substrate and extends in parallel in a first direction. The gate electrodes crosses over the active patterns in a second direction. One gate electrode is electrically connected to the first pad. The electrode pattern is disposed at a side of the gate electrode electrically connected to the first pad. The electrode pattern is electrically connected to the second pad. The electrode pattern crosses over the active patterns. An overlapping area of the electrode pattern and the active patterns in each test structure is different from an overlapping area of the electrode pattern and the active patterns in other test structures.
Abstract translation: 提供半导体器件。 第一和第二焊盘电连接到多个测试结构。 每个测试结构包括有源区,有源图案,栅电极和电极图案。 活动区域包括圆角部分。 有源图案从半导体衬底突出并沿第一方向平行延伸。 栅电极在第二方向上跨过有源图案。 一个栅电极电连接到第一焊盘。 电极图案设置在与第一焊盘电连接的栅电极的一侧。 电极图案电连接到第二垫。 电极图案穿过有源图案。 每个测试结构中的电极图案和活性图案的重叠区域与其他测试结构中的电极图案和活动图案的重叠区域不同。
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