公开(公告)号：US20240429202A1

公开(公告)日：2024-12-26

申请号：US18417004

申请日：2024-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SANGHO SHIN ,  YOUNG LYONG KIM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package includes: a first substrate including lower bonding pads; at least one semiconductor chip disposed on the first substrate; bumps disposed on a first surface of the first substrate; and a mold layer disposed on the first substrate and covering the at least one semiconductor chip, wherein the bumps include: a pillar portion bonded to the first surface of the first substrate; a solder portion bonded to a first surface of the pillar portion; and a metal layer including a material including high-melting-point metal atoms, wherein the metal layer covers a first surface of the solder portion, wherein the solder portion includes the high-melting-point metal atoms.