公开(公告)号：US20250167155A1

公开(公告)日：2025-05-22

申请号：US18785840

申请日：2024-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEUNGSOO HA ,  Seunggeol RYU ,  YUN-HEE LEE ,  Yiseul HAN

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498 ,  H01L25/10 ,  H10B80/00

Abstract: A semiconductor package may include a lower redistribution layer, a first semiconductor chip on the lower redistribution layer, a second semiconductor chip on the first semiconductor chip, under-bump patterns between the first semiconductor chip and the second semiconductor chip, and connection terminals between the under-bump patterns and the second semiconductor chip. The under-bump patterns may include a first under-bump pattern connected to two of the connection terminals and a second under-bump pattern connected to one of the connection terminals. A power or ground voltage of the second semiconductor chip may be applied through the first under-bump pattern.

公开(公告)号：US20230130453A1

公开(公告)日：2023-04-27

申请号：US17827018

申请日：2022-05-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEOKBEOM YONG ,  DONGCHUL YANG ,  YUNHEE LEE ,  SEUNGSOO HA

IPC: H01L23/498 ,  H01L25/10 ,  H01L25/18

Abstract: Provided is a semiconductor package with high reliability signal characteristics and a memory module including the semiconductor package. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, and connection terminals arranged on a lower surface of the package substrate. The connection terminals are arranged in a two-dimensional array structure in a first direction and a second direction perpendicular to the first direction, and two adjacent terminals with a shortest distance therebetween among data signal (DQ) terminals and command and address signal (CA) terminals included in the connection terminals are arranged in a diagonal direction between the first direction and the second direction.