公开(公告)号：US20220301958A1

公开(公告)日：2022-09-22

申请号：US17535937

申请日：2021-11-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNGWOO PARK ,  SOOHYUN NAM ,  HYUNJUNG SONG ,  MINSEUNG YOON

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367 ,  H01L25/18

Abstract: A semiconductor package includes a circuit board mounting a first semiconductor chip and a second semiconductor chip laterally separated by an intermediate space, an underfill including an extended portion protruding upward into the intermediate space, a surface modification layer on opposing side surfaces of the first semiconductor chip and the second semiconductor chip, wherein wettability of the underfill with respect to the surface modification layer is less than wettability of the underfill with respect to the side surfaces of the first semiconductor chip and the second semiconductor chip, and a molding member on the upper surface of the circuit board, covering an upper surface of the extended portion of the underfill, and surrounding the first semiconductor chip and the second semiconductor chip.