公开(公告)号：US20190229023A1

公开(公告)日：2019-07-25

申请号：US16236761

申请日：2018-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG-BO SHIM ,  JE-HYUN LEE

IPC: H01L21/66 ,  G01B15/00

Abstract: A wafer measurement system for measuring a measurable characteristic of a first measurement target formed on a wafer includes: a memory and a processor. The memory is configured to store an image of the wafer, multiple templates each including at least one line, and a measurement program. The processor is accessible to the memory and is configured to execute multiple modules included in the measurement program. The modules include: a template selection module configured to receive the templates and select a measurement template corresponding to a shape of the first measurement target; a template matching module configured to match the measurement template to the first measurement target; and a measurement module configured to measure the measurable characteristic of the first measurement target based on position information of the measurement template.