公开(公告)号：US20170170166A1

公开(公告)日：2017-06-15

申请号：US15364890

申请日：2016-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG-JUN SONG ,  YOUNG-MIN KIM ,  CHANG-SU KIM ,  HAN-GU KIM

IPC: H01L27/02 ,  H01L27/12 ,  H01L29/786 ,  H01L29/866 ,  H01L23/535

CPC classification number: H01L27/0255 ,  H01L23/535 ,  H01L27/0259 ,  H01L27/0292 ,  H01L27/1225 ,  H01L29/7869 ,  H01L29/866

Abstract: A film-type semiconductor package includes a semiconductor integrated circuit and a dummy metal pattern. The semiconductor integrated circuit is formed on a film and includes an electrostatic discharge (ESD) protection circuit. The dummy metal pattern is formed on the film and is electrically connected to the ESD protection circuit through a first wiring formed on the film.