公开(公告)号：US20210057388A1

公开(公告)日：2021-02-25

申请号：US17094267

申请日：2020-11-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： KYUNG SUK OH ,  DO-HYUN KIM ,  SUNWON KANG

IPC: H01L25/065 ,  H01L25/00

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip and a connection structure. The second semiconductor chip includes a first segment that protrudes outwardly beyond one side of the first semiconductor chip and a second connection pad on a bottom surface of the first segment of the second semiconductor chip. The connection structure includes a first structure between the substrate and the first segment of the second semiconductor chip and a first columnar conductor penetrating the first structure to be in contact with the substrate and being disposed between the second connection pad and the substrate, thereby electrically connecting the second semiconductor chip to the substrate.

公开(公告)号：US20200075551A1

公开(公告)日：2020-03-05

申请号：US16385363

申请日：2019-04-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： KYUNG SUK OH ,  DO-HYUN KIM ,  SUNWON KANG

IPC: H01L25/065 ,  H01L25/00

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip and a connection structure. The second semiconductor chip includes a first segment that protrudes outwardly beyond one side of the first semiconductor chip and a second connection pad on a bottom surface of the first segment of the second semiconductor chip. The connection structure includes a first structure between the substrate and the first segment of the second semiconductor chip and a first columnar conductor penetrating the first structure to be in contact with the substrate and being disposed between the second connection pad and the substrate, thereby electrically connecting the second semiconductor chip to the substrate.

公开(公告)号：US20250038156A1

公开(公告)日：2025-01-30

申请号：US18442252

申请日：2024-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNG-JA KIM ,  SUNWON KANG ,  MI-NA CHOI

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498

Abstract: A semiconductor package includes a first substrate. A second substrate is spaced apart from the first substrate. A semiconductor chip is between the first substrate and the second substrate. The semiconductor chip is electrically connected to the second substrate. A molding layer surrounds the semiconductor chip. A plate directly contacts a bottom surface of the semiconductor chip. A heat transfer structure connects the plate and the first substrate to each other.