公开(公告)号：US11049815B2

公开(公告)日：2021-06-29

申请号：US16584027

申请日：2019-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jooyoung Choi ,  Taewook Kim ,  Byungho Kim ,  Sangseok Hong ,  Jaehoon Choi ,  Seongjin Shin

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

Abstract: A semiconductor package includes a connection structure having first and second surfaces opposing each other and including a redistribution layer. A semiconductor chip is disposed on the first surface of the connection structure and has connection pads connected to the redistribution layer. An encapsulant is disposed on the first surface of the connection structure and covers the semiconductor chip. A support pattern is disposed on a portion of an upper surface of the encapsulant. A heat dissipation bonding material has a portion embedded in the encapsulant in a region overlapping the semiconductor chip and extends to the upper surface of the encapsulant so as to cover the support pattern. A heat dissipation element is bonded to the upper surface of the encapsulant by the heat dissipation bonding material.