公开(公告)号：US20200335469A1

公开(公告)日：2020-10-22

申请号：US16822300

申请日：2020-03-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghoon KIM ,  Jaehyun LIM ,  Yuntae LEE ,  Sayoon KANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065

Abstract: Provided is a semiconductor package including a package structure including a base connection member including a redistribution layer, a first semiconductor chip including a plurality of first connection pads connected to the redistribution layer, an encapsulant disposed on the base connection member and covering at least a portion of the first semiconductor chip, and a backside connection member disposed on the encapsulant and including a backside wiring layer electrically connected to the redistribution layer, and a second semiconductor chip disposed on the base connection member or the backside connection member, the second semiconductor chip including a plurality of second connection pads connected to the redistribution layer or the backside wiring layer, the second semiconductor chip including a logic circuit, the first semiconductor chip including a logic input and output terminals that are connected to the logic circuit through at least one of the redistribution layer and the backside wiring layer.