公开(公告)号：US20190193238A1

公开(公告)日：2019-06-27

申请号：US16052294

申请日：2018-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok Ryul Kim ,  Sunghyup Kim ,  Sanghoon Lee

IPC: B24B37/26 ,  B24B37/22

CPC classification number: B24B37/26 ,  B24B37/22

Abstract: A wafer polishing pad includes a first pad having a first surface configured to receive a platen. A protrusion is disposed on the first surface of the first pad. The protrusion is disposed on an edge region of the first pad in a plan view such that a side surface of the protrusion makes contact with a side surface of the platen when the first pad is disposed on the platen.

公开(公告)号：US20160224701A1

公开(公告)日：2016-08-04

申请号：US14987136

申请日：2016-01-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok Ryul Kim ,  Bang Weon Lee

IPC: G06F17/50

CPC classification number: G06F17/5009 ,  G06F17/5036

Abstract: A design validation system including a plurality of design validation devices receiving design data from a user and performing a simulation process to validate at least one of a plurality of product characteristics calculated from the design data and a simulation management device having simulation information about the characteristics required for a performance of the simulation process and transmitting the simulation information to the design validation devices upon request by the plurality of design validation devices, wherein the plurality of design validation devices simultaneously perform the simulation processes to validate the product characteristics.

Abstract translation: 一种设计验证系统，包括从用户接收设计数据的多个设计验证设备，并且执行模拟过程以验证从设计数据计算的多个产品特性中的至少一个以及具有关于所需特性的模拟信息的仿真管理设备 用于模拟过程的执行，并且通过所述多个设计验证设备的请求将所述仿真信息发送到所述设计验证设备，其中所述多个设计验证设备同时执行所述仿真过程以验证所述产品特性。