公开(公告)号：US20190341353A1

公开(公告)日：2019-11-07

申请号：US16105942

申请日：2018-08-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mi Ja HAN ,  Dae Hyun PARK ,  Seong Hwan LEE ,  Sang Jong LEE

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/16

Abstract: A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic wave shielding layer disposed on the semiconductor chip and including a plurality of degassing holes. The electromagnetic wave shielding layer includes a first region and a second region in which densities of the degassing holes are different from each other, the first region having a density of the degassing holes higher than a density of the degassing holes in the second region.