公开(公告)号：US20210398870A1

公开(公告)日：2021-12-23

申请号：US17462269

申请日：2021-08-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Tae HWANG ,  Jae-Choon KIM ,  Kyung-Suk OH ,  Woon-Bae KIM ,  Jae-Min JUNG

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/14

Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.