公开(公告)号：US20220408550A1

公开(公告)日：2022-12-22

申请号：US17573156

申请日：2022-01-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongyoon SEO ,  Hwanwook PARK ,  Dohyung KIM ,  Bora KIM ,  Seungyeong LEE ,  Wonseop LEE ,  Yunho LEE ,  Yejin CHO

IPC: H05K1/02 ,  H05K1/11 ,  G11C11/4076

Abstract: A PCB includes a plurality of layers spaced apart in a vertical direction, a first detection pattern and a second detection pattern and pads connected to the first detection pattern and the second detection pattern. The first detection pattern and the second detection pattern are provided in a respective one of a first layer and a second layer adjacent to each other such that the first detection pattern and the second detection pattern are opposed to each other. The pads are provided in an outmost layer. Each of the first detection pattern and the second detection includes at least one main segment extending in at least one of first and second horizontal directions and a diagonal direction. A time domain reflectometry connected to a pair of pads detects a misalignment of the PCB by measuring differential characteristic impedance of the first detection pattern and the second detection pattern.