公开(公告)号：US10107486B2

公开(公告)日：2018-10-23

申请号：US15189616

申请日：2016-06-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-sung Kim ,  Tae-hee Song ,  Young-hyo Eun ,  Shin-min Rhee ,  Ju-hyun Song ,  Sang-woo Ha ,  In-je Sung

IPC: F21V3/00 ,  F21V23/00 ,  H01L33/58 ,  G02F1/1335

Abstract: Provided is a light emitting diode (LED) module. The LED module includes: a light emitting chip on a substrate; and an optical lens on the substrate configured to envelop the light emitting chip, wherein the optical lens includes a body comprising a groove receiving the light emitting chip therein and having a dome-shaped upper surface and a ring-shaped supporting portion protruding from a lower surface of the body.