公开(公告)号：US20220012141A1

公开(公告)日：2022-01-13

申请号：US17208312

申请日：2021-03-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Wook KIM ,  So-Geum KIM ,  Daehun YOU ,  Jaehwan LIM

IPC: G06F11/20 ,  G06F1/28

Abstract: An electronic device includes: a power supply to supply a first power and a second power; a first solid state drive (SSD) backplane and a second SSD backplane to receive the first power from the power supply, each of the first solid state drive (SSD) backplane and the second SSD backplane including two or more SSDs; and a baseboard to receive the second power from the power supply, to independently power on and power off the first SSD backplane and the second SSD backplane, and to access the SSDs of an SSD backplane that is in a power-on state from among the first SSD backplane and the second SSD backplane. In response to an increase in temperature of an SSD backplane that is in a power-off state, at least one SSD of the SSD backplane that is in the power-off state may be powered on.