公开(公告)号：US20230148721A1

公开(公告)日：2023-05-18

申请号：US18100306

申请日：2023-01-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonseuk LEE ,  Heesuk WANG ,  Namhyun KANG ,  Minah KOH ,  Hakdo KIM ,  Sol LEE

IPC: A45C11/00 ,  G06F1/16 ,  A45C13/00 ,  A45C13/10

CPC classification number: A45C11/00 ,  G06F1/1628 ,  A45C13/005 ,  A45C13/1069 ,  A45C2011/003 ,  A45C2200/15

Abstract: According to an embodiment of the present invention, an electronic device cover includes: a first plate that can be attached/detached to/from one surface of the electronic device; a second plate overlappingly coupled to the first plate; and a third plate which is connected to the second plate by a hinge and of which the angle formed with the first plate changes according to rotation with respect to the second plate, wherein the second plate and/or the third plate includes a composite material sheet, and at least a portion of the hinge can be positioned inside the composite material sheet. Other various embodiments are possible.