公开(公告)号：US10105943B2

公开(公告)日：2018-10-23

申请号：US15139996

申请日：2016-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Do Hyung Kim ,  Dong-Hee Han ,  Do-Wan Kim ,  Byeong-Cheol Kim ,  Hak Rae Kim ,  Jung Hun Sung ,  Sung-Gwan Woo ,  Kyung Woon Jang ,  Chang Kyu Chung ,  Kyoung Hern Hong ,  Sung-Ju Hwang

IPC: B32B38/18 ,  B32B37/12 ,  G02F1/13

Abstract: Disclosed herein are a lamination apparatus which adheres substrates to a cover window having a curved surface and a lamination method using the same. The lamination apparatus includes a first jig on which a cover window is mounted, wherein a curved surface portion is formed in the cover window and a curvature center thereof is positioned behind the curved surface portion, a second jig on which a guide member is seated, wherein a substrate is mounted on the guide member and the guide member has a width greater than that of the substrate, and an interference member provided to interfere with both facing front surfaces of the guide member, wherein the interference member interferes with the guide member and the guide member is bent when the second jig approaches the first jig.