公开(公告)号：US09813093B2

公开(公告)日：2017-11-07

申请号：US15179157

申请日：2016-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-Jun Kim ,  Sung-soo Lee ,  Hwan-sun Hong ,  Ja-hun Lee ,  Cheol-hee Lee

IPC: H04B1/10 ,  H04B1/16

CPC classification number: H04B1/109 ,  H04B1/16

Abstract: A broadcast signal receiving apparatus, including a multi-layer printed circuit board comprising a transmission line configured to connect with at least one component mounted on the multi-layer printed circuit board, the at least one component being configured to process a broadcast signal received from an outside of the apparatus through a cable, wherein a signal line for receiving the broadcast signal is at least partially provided on an inner layer of the multi-layer printed circuit board.