公开(公告)号：US20250087624A1

公开(公告)日：2025-03-13

申请号：US18611241

申请日：2024-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jing Cheng LIN ,  Sungjin Han ,  Gyeongjae JO ,  Hyunchul JUNG ,  Youngkun JEE

IPC: H01L23/00

Abstract: A semiconductor package manufacturing apparatus is provided and includes a bonding head including at least one vacuum hole, and at least one adsorption trench in a lower surface of the bonding head and connected to the at least one vacuum hole. A lower part of the bonding head includes at least one first portion, and a second portion spaced apart from the at least one first portion and surrounding the at least one first portion in a plan view. The at least one adsorption trench is defined by and between the at least one first portion and the second portion, and at least a portion of an inner surface of the at least one adsorption trench and at least a portion of an outer surface of the at least one adsorption trench are curved in the plan view.