公开(公告)号：US20210375805A1

公开(公告)日：2021-12-02

申请号：US17398756

申请日：2021-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Ho KO ,  Dae Hee LEE ,  Hyun Chul JUNG ,  Myeong Ho HONG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/52 ,  H01L21/56

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.

公开(公告)号：US20200312801A1

公开(公告)日：2020-10-01

申请号：US16663735

申请日：2019-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Ho KO ,  Dae Hee LEE ,  Hyun Chul JUNG ,  Myeong Ho HONG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/52 ,  H01L21/56

Abstract: Provided in a semiconductor package substrate including a semiconductor chip including a connection pad, an encapsulant encapsulating at least a portion of the semiconductor chip, a connection member disposed on the semiconductor chip and the encapsulant, the connection member including a redistribution layer that is electrically connected to the connection pad, a first passivation layer disposed on the connection member, and an adhesive layer disposed on at least one of a top surface of the encapsulant and a bottom surface of the first passivation layer in a region outside of the semiconductor chip.