公开(公告)号：US20200066613A1

公开(公告)日：2020-02-27

申请号：US16211928

申请日：2018-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doo Hwan LEE ,  Tae Je CHO

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes: a semiconductor chip having an active surface, having connection pads disposed thereon, and an inactive surface, opposing the active surface; an encapsulant covering the inactive surface of the semiconductor chip; a thermally conductive via penetrating through at least a portion of the encapsulant on the inactive surface of the semiconductor chip and physically spaced apart from the inactive surface of the semiconductor chip; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads.