Abstract:
Provided is a semiconductor device including at least one front-end-of-line (FEOL) element connected to an interconnect structure, the interconnect structure including: a 1st metal pattern or via structure with a spacer structure on a sidewall thereof; and a 1st interlayer dielectric (ILD) layer formed at sides of the 1st metal pattern or via structure with the spacer structure on the sidewall thereof, wherein the spacer structure includes a dielectric material different from a material included in the 1st ILD layer.
Abstract:
A method of operating an integrated circuit is provided. The method includes receiving a data block offset from a second storage device, obtaining a target entry address using the data block offset, and reading an entry among a plurality of entries comprised in a buffer descriptor stored in a first storage device based on the target entry address. The method also includes reading data from a data buffer among a plurality of data buffers included in the first storage device using a physical address included in the entry and transmitting the data to the second storage device.