公开(公告)号：US20250139762A1

公开(公告)日：2025-05-01

申请号：US18890365

申请日：2024-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunchul KIM ,  Daewoong Choi ,  Ohchel Kwon ,  Hyunmo Kang ,  Taecheon Kim ,  Jinhong Park ,  Wooseok Choe

IPC: G06T7/00 ,  H01L21/66

Abstract: A wafer inspection method includes: obtaining an inspection image by capturing an image of a wafer and an identification tag; obtaining an inspection profile by quantifying the identification tag in the inspection image; and performing a surface inspection of the wafer based on the obtained inspection profile.