专利检索 ap:("SAMSUNG ELECTRONICS CO., LTD.") AND inv:"Takahiro YOSHII" 第 1 页

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发明申请
ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME 有权

公开(公告)号：US20220324887A1

公开(公告)日：2022-10-13

申请号：US17708323

申请日：2022-03-30

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Seungmin RYU , Younsoo KIM , Jaewoon KIM , Kazuki HARANO , Kazuya SAITO , Takanori KOIDE , Yutaro AOKI , Gyuhee PARK , Younjoung CHO , Wakana FUSE , Yoshiki MANABE , Hiroyuki UCHIUZOU , Masayuki KIMURA , Takahiro YOSHII

IPC分类号： C07F9/00 , H01L49/02 , H01L27/108 , C23C16/34 , C23C16/455

摘要： An organometallic adduct compound and a method of manufacturing an integrated circuit device, the organometallic adduct compound being represented by General Formula (I):