公开(公告)号：US20220367367A1

公开(公告)日：2022-11-17

申请号：US17517798

申请日：2021-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeongmun KANG ,  Woodong LEE ,  Insup SHIN ,  Youngwoo LIM

IPC: H01L23/538 ,  H01L25/065

Abstract: A carrier structure including semiconductor chip stack structures; and a carrier tape including a plurality of pockets respectively accommodating the semiconductor chip stack structures, wherein each of the plurality of pockets includes a bottom surface, first sidewalls in four corner regions of each of the plurality of pockets, and second sidewalls between adjacent first sidewalls, each of the first sidewalls has a first portion having a first inclination angle and a second portion on the first portion and having a second inclination angle, the second inclination angle being greater than the first inclination angle, and vertices of lower surfaces of the semiconductor chip stack structures are in contact with the first sidewalls.