公开(公告)号：US20230005814A1

公开(公告)日：2023-01-05

申请号：US17705931

申请日：2022-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUNSOO CHUNG ,  YOUNGLYONG KIM ,  INHYO HWANG

IPC: H01L23/427 ,  H01L23/498

Abstract: A semiconductor package includes an interposer, a first semiconductor chip attached onto the interposer, second semiconductor chips stacked on the first semiconductor chip, at least two heat sinks mounted on the interposer and spaced apart from the second semiconductor chips, and a molding layer surrounding the second semiconductor chips and the at least two heat sinks.

公开(公告)号：US20230111207A1

公开(公告)日：2023-04-13

申请号：US17850488

申请日：2022-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUNSOO CHUNG ,  DAEWOO KIM ,  YOUNGLYONG KIM

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes; a redistribution wiring layer, a controller chip centrally disposed on the redistribution wiring layer, a first sealant disposed on the redistribution wiring layer, wherein the controller chip is buried in the first sealant, through vias connected to the redistribution wiring layer through the first sealant, and a sub-package disposed on an upper surface of the first sealant. The sub-package may include a first stack structure disposed to one side of the controller chip on the upper surface of the first sealant and including vertically stacked chips, a second stack structure disposed to another side of the controller chip on the upper surface of the first sealant adjacent to the first stack structure in a first horizontal direction and including vertically stacked chips, and a second sealant sealing the first stack structure and the second stack structure.