公开(公告)号：US20250153305A1

公开(公告)日：2025-05-15

申请号：US18946379

申请日：2024-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yehwan KIM ,  Ungyu PAIK ,  Samjong CHOI ,  Taeseup SONG ,  Ganggyu LEE ,  Donghwan KIM

IPC: B24B37/26 ,  B24B37/10 ,  B24B37/24

Abstract: A chemical mechanical polishing pad includes a body having a cylindrical shape and extending in a vertical direction, the body including a plurality of first grooves extending downward in the vertical direction from an upper surface of the body, and a plurality of second grooves extending downward in the vertical direction inside the body. Each of the plurality of first grooves is exposed upward in the vertical direction from the upper surface of the body, each of the plurality of second grooves is located inside the body such that upper ends of the plurality of second grooves is below the upper surface of the body, and at least two of the plurality of first grooves have different depths from each other.