公开(公告)号：US20240241513A1

公开(公告)日：2024-07-18

申请号：US18421475

申请日：2024-01-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chonghoon LEE ,  Yeonkyu PARK ,  Jinyong PARK

IPC: G05B23/02

CPC classification number: G05B23/0297 ,  G05B23/0283

Abstract: Various embodiments of the present disclosure disclose a method and apparatus, and comprise: a communication module comprising communication circuitry; a memory; and at least one processor comprising processing circuitry operatively connected to the communication module and/or the memory, wherein at least one processor is configured to: generate an AI predictive model based on component input data; acquire fail result data according to the AI predictive model;
acquire pass result data according to the fail result data; and update the AI predictive model based on at least one of the component input data, the fail result data, and the pass result data.