公开(公告)号：US20190371731A1

公开(公告)日：2019-12-05

申请号：US16149102

申请日：2018-10-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung Sam KANG ,  Jin Su KIM ,  Yong Jin PARK ,  Young Gwan KO ,  Yong Jin SEOL

IPC: H01L23/538 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00 ,  H01L23/367 ,  H01L23/31

Abstract: A semiconductor package includes a support member including a resin body having a first surface and a second surface opposing each other and having a cavity, and at least one passive component embedded in the resin body and having a connection terminal exposed from the first surface; a first connection member disposed on the first surface of the resin body, and having a first redistribution layer on the first insulating layer and connected to the connection terminal; a second connection member disposed on the first connection member and covering the cavity, and having a second redistribution layer on the second insulating layer and connected to the first redistribution layer; and a semiconductor chip disposed on the second connection member in the cavity.