公开(公告)号：US20230246339A1

公开(公告)日：2023-08-03

申请号：US18299916

申请日：2023-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongeui HONG ,  Yonghyun YOON ,  Youngjun CHO

IPC: H01Q9/04 ,  H01Q1/42

CPC classification number: H01Q9/0414 ,  H01Q1/422

Abstract: An electronic device according to an embodiment may include: a housing forming at least a part of an exterior of the electronic device; a printed circuit board (PCB) disposed in the housing; a dielectric layer disposed between the PCB and the housing and comprising a first surface facing a surface of the housing and a second surface facing the PCB; a patch antenna disposed on the first surface of the dielectric layer and electrically connected to a first point of the PCB; a conductive plate disposed adjacent to the second surface of the dielectric layer, connected to a ground on the PCB through a second point spaced apart from the first point, and overlapping with the patch antenna; and a wireless communication circuit electrically connected to the PCB, wherein the wireless communication circuit is configured to feed power to the patch antenna through the first point of the PCB to transmit or receive a first signal of a first frequency band, and to transmit and/or receive a second signal of a second frequency band different from the first frequency band through a first electric path including the patch antenna, the conductive plate, and the ground.