公开(公告)号：US20230264350A1

公开(公告)日：2023-08-24

申请号：US17957967

申请日：2022-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daejung KIM ,  Minyoung KANG ,  Sungsoo KIM ,  Sohee KIM ,  Yongsoo YOO

IPC: B25J9/16 ,  B25J19/02 ,  B25J11/00

CPC classification number: B25J9/163 ,  B25J9/1697 ,  B25J19/021 ,  B25J11/0095 ,  B25J9/1684

Abstract: A method includes performing a substrate processing process by carrying a substrate into a chamber, and disposing the substrate in a loading region of the chamber, capturing an image of a lower surface of the substrate to acquire a first image, identifying particle patterns formed on the lower surface of the substrate in the substrate processing process, and an edge of the substrate, from the first image, calculating a first alignment error value of a deviation between an approximate position value for the center of the loading region calculated from the particle patterns and an approximate position value for a center of the substrate calculated from the edge of the substrate, and determining a point in time for teaching a transfer robot that deposits the substrate into the chamber, based on the first alignment error value.

公开(公告)号：US20250091203A1

公开(公告)日：2025-03-20

申请号：US18961702

申请日：2024-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daejung KIM ,  Minyoung KANG ,  Sungsoo KIM ,  Sohee KIM ,  Yongsoo YOO

IPC: B25J9/16 ,  B25J11/00 ,  B25J19/02

Abstract: A method includes performing a substrate processing process by carrying a substrate into a chamber, and disposing the substrate in a loading region of the chamber, capturing an image of a lower surface of the substrate to acquire a first image, identifying particle patterns formed on the lower surface of the substrate in the substrate processing process, and an edge of the substrate, from the first image, calculating a first alignment error value of a deviation between an approximate position value for the center of the loading region calculated from the particle patterns and an approximate position value for a center of the substrate calculated from the edge of the substrate, and determining a point in time for teaching a transfer robot that deposits the substrate into the chamber, based on the first alignment error value.