公开(公告)号：US20200373341A1

公开(公告)日：2020-11-26

申请号：US16667041

申请日：2019-10-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungeun JO ,  Youngshin KWON

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor package including an image sensor chip including an active pixel sensor region and a non-sensing region, a plurality of chip pads being in the non-sensing region; a printed circuit board on one side of the image sensor chip, the printed circuit board including a plurality of bonding pads; conductive wires respectively connecting the plurality of chip pads to the plurality of bonding pads; a bonding dam at a periphery of the active pixel sensor region; a cover glass on the bonding dam and facing another side of the image sensor chip; and an encapsulation layer covering a side surface of the bonding dam, a side surface of the cover glass, an edge of a lower surface of the cover glass, the non-sensing region, and an edge of an upper surface of the printed circuit board, wherein the bonding dam is spaced apart from an end of a side surface of the image sensor chip by a distance of 80 μm to 150 μm has a height of 50 μm to 150 μm from the image sensor chip, and has a width of 160 μm to 240 μm.