公开(公告)号：US20140130691A1

公开(公告)日：2014-05-15

申请号：US14078763

申请日：2013-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ki-yeon YANG ,  Yun-Woo NAM

IPC: B41N6/00

CPC classification number: B41N6/00 ,  H01L21/6838

Abstract: A stamp structure includes a stamp frame having a plate part. The plate part includes a plurality of holes. The plurality of holes are configured to facilitate the adsorption of an object to the plate part during a transfer of the object from a donor substrate to a target substrate.

Abstract translation: 邮票结构包括具有板部的印章框架。 板部包括多个孔。 多个孔构造成便于在将物体从施主衬底转移到目标衬底期间吸附物体到板部件。