公开(公告)号：US20230061795A1

公开(公告)日：2023-03-02

申请号：US17983487

申请日：2022-11-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsang CHO ,  Heeseok LEE ,  Yunhyeok IM ,  Moonseob JEONG

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.

公开(公告)号：US20200328187A1

公开(公告)日：2020-10-15

申请号：US16592897

申请日：2019-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsang CHO ,  Heeseok LEE ,  Yunhyeok IM ,  Moonseob JEONG

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package includes a package substrate, a lower semiconductor chip on the package substrate, an interposer on the lower semiconductor chip, the interposer including a plurality of pieces spaced apart from each other, an upper semiconductor chip on the interposer, and a molding member covering the lower semiconductor chip and the interposer.