公开(公告)号：US12144115B2

公开(公告)日：2024-11-12

申请号：US18084994

申请日：2022-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun Lee ,  Dohyeon Kim ,  Byeongkeol Kim ,  Jinsu Kim ,  Seokjoon Park ,  Jungje Bang ,  Hoyeon Seo ,  Jongbum Lee ,  Jongmin Jeon

IPC: H05K1/14 ,  B32B3/26 ,  B32B7/12

Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder.

公开(公告)号：US20250096186A1

公开(公告)日：2025-03-20

申请号：US18970353

申请日：2024-12-05

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Chagyu SONG ,  Hoyeon Seo ,  Jaeyeon Ra ,  Kookjin Park ,  Chulwoo Park ,  Dongjun Shin ,  Jongbum Lee ,  Gyeongmin Jin

IPC: H01L23/00 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H10B80/00

Abstract: An electronic device may be provided and include: a printed circuit board includes a first side and a second side perpendicular to the first side; a plurality of solder balls on a surface of the printed circuit board and spaced apart from the first side and the second side; an electronic component including at least one circuit, the electronic component on at least some of the plurality of solder balls; a resin along the first side and filling a portion of a space between the surface of the printed circuit board and the electronic component; and a blocking structure in or on the surface of the printed circuit board, the blocking structure being between the plurality of solder balls and the first side, and extending along the first side such as to separate the at least some of the plurality of solder balls from the resin.